Potting
+
  • Potting

Product Features

· High purity, excellent insulation effect, strong waterproof performance, can maintain good electrical performance even under harsh conditions.

· Can accelerate curing under heating conditions.

· Good flame retardant effect, its flame retardancy can reach UL94-V1 or UL94-V0 level, fully complies with EU ROHS directive requirements.

· Low viscosity, and the two-component ratio is 1:1, easy to operate, suitable for mechanized mass production.

· No by-products are produced during the curing reaction.

Product Applications

· Suitable for insulation, waterproofing, fixing, and flame retardancy of electronic components and DC modules.

· Applicable to surfaces of materials such as PC (Poly-carbonate), PP, ABS, PVC, and metals.

· High-power electronic components, power boxes, etc.

· Potting protection for module power supplies and circuit boards with high heat dissipation and temperature resistance requirements.

Product Parameter Table

Product Model

H9065

H9055

H9045

H9035

Components

A B

A B

A B

A B

Appearance

Dark gray White

Dark gray White

Dark gray White

Dark gray White

Before Vulcanization

Dynamic Viscosity (mPas)

5000±2000

5000±2000

3500±2000

5000±2000

Mixing Ratio of Components A and B

1:1

1:1

1:1

1:1

Operating Performance

Operating Time (min/25℃)

60-120

60-120

60-120

60-120

Curing Time (H, 25℃)

8

8

8

8

Curing Time (min/80℃)

30

30

30

30

Hardness (Shore Aº)

65±3

55±3

45±3

35±3

Linear Expansion Coefficient [M/(m.K)]

≤2.2×10^4

≤2.2×10^4

≤2.2×10^4

≤2.2×10^4

After Vulcanization

Thermal Conductivity [W/(M.k)]

≥0.8

≥0.8

≥0.8

≥0.8

Dielectric Strength (KV/mm)

≥25

≥25

≥25

≥25

Dielectric Constant (1.2MHZ)

3.0-3.3

3.0-3.3

3.0-3.3

3.0-3.3

Volume Resistivity (Ω.CM)

≥1.0×10^16

≥1.0×10^16

≥1.0×10^16

≥1.0×10^16

Flame Retardancy

UL94-V1

UL94-V1

UL94-V1

UL94-V1

Product Image

Packaging Specifications:

40KG/set (A component 20KG + B component 20KG)

50KG/set (A component 25KG + B component 25KG)

400KG/set (A component 200KG + B component 200KG)

 

Keywords

Potting
+
  • Potting

Potting

Electronic potting adhesive is a type of two-component room temperature vulcanized silicone material that has flame retardancy and thermal conductivity. It can be cured at room temperature or by heating, and is divided into condensation type electronic potting adhesive and addition type electronic potting adhesive.


Get A Quote

Note: Please leave your contact information and our professionals will contact you as soon as possible!

Submit